Granted Patent
Utility
US 6,012,223 · App. 09/127,290
Process for structurally securing stick-leaded components to a circuit board
Inventor:
Lee R. Hinze
Patented Case
View Patent ↗
Granted: Jan 11, 2000
Filed: Jul 31, 1998
Inventor
Lee R. Hinze
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.