Granted Patent
Utility
US 6,013,136 · App. 08/764,703
Apparatus for plasma-supported back etching of a semiconductor wafer
Inventor:
Josef Mathuni
Patented Case
View Patent ↗
Granted: Jan 11, 2000
Filed: Dec 2, 1996
Inventor
Josef Mathuni
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.