IP Library Granted Patent US 6,013,877
Granted Patent Utility
US 6,013,877 · App. 09/041,157

Solder bonding printed circuit boards

Inventors: Yinon Degani, King Lien Tai
Patented Case View Patent ↗
Granted: Jan 11, 2000 Filed: Mar 12, 1998
Inventors
Yinon Degani
King Lien Tai
Assignee (at issue)
LUCENT TECHNOLOGIES INC.

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Quick Facts
Patent No.
US 6,013,877
App. No.
09/041,157
Filed
1998-03-12
Granted
2000-01-11
Kind
A