Granted Patent
Utility
US 6,013,948 · App. 09/053,274
Stackable chip scale semiconductor package with mating contacts on opposed surfaces
Inventors:
Salman Akram, Alan G. Wood, Warren M. Farnworth
Patented Case
View Patent ↗
Granted: Jan 11, 2000
Filed: Apr 1, 1998
Inventors
Salman Akram
Alan G. Wood
Warren M. Farnworth
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.