Granted Patent
Utility
US 6,014,318 · App. 09/166,220
Resin-sealed type ball grid array IC package and manufacturing method thereof
Inventor:
Shinji Takeda
Patented Case
View Patent ↗
Granted: Jan 11, 2000
Filed: Oct 5, 1998
Inventor
Shinji Takeda
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.