Granted Patent
Utility
US 6,015,722 · App. 09/369,800
Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate
Inventors:
Donald R. Banks, Ronald G. Pofahl, Mark F. Sylvester, William George Petefish, Paul J. Fischer
Patented Case
View Patent ↗
Granted: Jan 18, 2000
Filed: Aug 6, 1999
Inventors
Donald R. Banks
Ronald G. Pofahl
Mark F. Sylvester
William George Petefish
Paul J. Fischer
Assignee (at issue)
Gore Enterprise Holdings, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.