Granted Patent
Utility
US 6,015,758 · App. 09/140,332
Method of stripping a wafer of its film with gas injected into a CVD apparatus in which the wafer is disposed
Inventors:
Joong-Il An, Kyung Su Kim, Jung-Su Lim, Jung Ki Kim
Patented Case
View Patent ↗
Granted: Jan 18, 2000
Filed: Aug 26, 1998
Inventors
Joong-Il An
Kyung Su Kim
Jung-Su Lim
Jung Ki Kim
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.