IP Library › Granted Patent US 6,016,256
Granted Patent Utility
US 6,016,256 · App. 08/970,379

Multi-chip module having interconnect dies

Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn
Patented Case View Patent ↗
Granted: Jan 18, 2000 Filed: Nov 14, 1997
Inventors
Stanford W. Crane, Jr.
Lakshminarasimha Krishnapura
Yun Li
Moises Behar
Dan Fuoco
Bill Ahearn
Assignee (at issue)
The Panda Project

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Quick Facts
Patent No.
US 6,016,256
App. No.
08/970,379
Filed
1997-11-14
Granted
2000-01-18
Kind
A