IP Library › Granted Patent US 6,018,196
Granted Patent Utility
US 6,018,196 · App. 09/258,521

Semiconductor flip chip package

Inventor: David B. Noddin
Patented Case View Patent ↗
Granted: Jan 25, 2000 Filed: Feb 26, 1999
Inventor
David B. Noddin
Assignee (at issue)
W. L. Gore & Associates, Inc.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,018,196
App. No.
09/258,521
Filed
1999-02-26
Granted
2000-01-25
Kind
A