Granted Patent
Utility
US 6,019,271 · App. 08/893,714
Method for ultrasonic bonding flexible circuits
Inventors:
Brian John Hayden, Cuong Pham, Rosa Lynda Nuno, Mark Stephen Topping
Patented Case
View Patent ↗
Granted: Feb 1, 2000
Filed: Jul 11, 1997
Inventors
Brian John Hayden
Cuong Pham
Rosa Lynda Nuno
Mark Stephen Topping
Assignee (at issue)
Ford Motor Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.