IP Library Granted Patent US 6,020,622
Granted Patent Utility
US 6,020,622 · App. 09/038,111

Trench isolation for semiconductor device with lateral projections above substrate

Inventors: Nobuyuki Tsuda, Hideki Fujikake
Patented Case View Patent ↗
Granted: Feb 1, 2000 Filed: Mar 11, 1998
Inventors
Nobuyuki Tsuda
Hideki Fujikake
Assignee (at issue)
WINBOND ELECTRONICS CORP.

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Quick Facts
Patent No.
US 6,020,622
App. No.
09/038,111
Filed
1998-03-11
Granted
2000-02-01
Kind
A