Granted Patent
Utility
US 6,022,758 · App. 08/765,473
Process for manufacturing solder leads on a semiconductor device package
Inventor:
Pierre Avner Badehi
Patented Case
View Patent ↗
Granted: Feb 8, 2000
Filed: Feb 21, 1997
Inventor
Pierre Avner Badehi
Assignee (at issue)
SHELL CASE LIMITED
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.