Granted Patent
Utility
US 6,028,365 · App. 09/049,939
Integrated circuit package and method of fabrication
Inventors:
Salman Akram, Warren M. Farnworth
Patented Case
View Patent ↗
Granted: Feb 22, 2000
Filed: Mar 30, 1998
Inventors
Salman Akram
Warren M. Farnworth
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.