Granted Patent
Utility
US 6,030,882 · App. 09/223,200
Method for manufacturing shallow trench isolation structure
Inventor:
Gary Hong
Patented Case
View Patent ↗
Granted: Feb 29, 2000
Filed: Dec 30, 1998
Inventor
Gary Hong
Assignee (at issue)
United Semiconductor Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.