Granted Patent
Utility
US 6,033,588 · App. 09/000,966
Method for improving differential etching rate of a metallic layer
Inventor:
Chia-Chieh Yu
Patented Case
View Patent ↗
Granted: Mar 7, 2000
Filed: Dec 30, 1997
Inventor
Chia-Chieh Yu
Assignee (at issue)
United Semiconductor Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.