Granted Patent
Utility
US 6,037,653 · App. 09/046,656
Semiconductor lead frame having multi-layered plating layer including copper-nickel plating layer
Inventors:
Joong-do Kim, Kyoung-soon Bok
Patented Case
View Patent ↗
Granted: Mar 14, 2000
Filed: Mar 24, 1998
Inventors
Joong-do Kim
Kyoung-soon Bok
Assignee (at issue)
Samsung Aerospace Industries, Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.