Granted Patent
Utility
US 6,037,667 · App. 09/139,168
Socket assembly for use with solder ball
Inventors:
David R. Hembree, Salman Akram
Patented Case
View Patent ↗
Granted: Mar 14, 2000
Filed: Aug 24, 1998
Inventors
David R. Hembree
Salman Akram
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.