Granted Patent
Utility
US 6,039,633 · App. 09/164,916
Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
Inventor:
Dinesh Chopra
Patented Case
View Patent ↗
Granted: Mar 21, 2000
Filed: Oct 1, 1998
Inventor
Dinesh Chopra
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.