Granted Patent
Utility
US 6,041,495 · App. 09/087,929
Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same
Inventors:
Jin H. Yoon, Gi Bum Park, In Pyo Hong, Yong-Don Kim, Myung-Kee Chung
Patented Case
View Patent ↗
Granted: Mar 28, 2000
Filed: Jun 1, 1998
Inventors
Jin H. Yoon
Gi Bum Park
In Pyo Hong
Yong-Don Kim
Myung-Kee Chung
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.