Granted Patent
Utility
US 6,042,682 · App. 09/083,968
Method of thermocompression bonding a supporting substrate to a semiconductor bare chip
Inventors:
Takuo Funaya, Koji Matsui
Patented Case
View Patent ↗
Granted: Mar 28, 2000
Filed: May 26, 1998
Inventors
Takuo Funaya
Koji Matsui
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.