Granted Patent
Utility
US 6,045,382 · App. 08/971,383
Socket apparatus for IC packages
Inventors:
Masao Tohyama, Hideki Sano
Patented Case
View Patent ↗
Granted: Apr 4, 2000
Filed: Nov 17, 1997
Inventors
Masao Tohyama
Hideki Sano
Assignee (at issue)
Texas Instruments Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.