Granted Patent
Utility
US 6,046,111 · App. 09/146,330
Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates
Inventor:
Karl M. Robinson
Patented Case
View Patent ↗
Granted: Apr 4, 2000
Filed: Sep 2, 1998
Inventor
Karl M. Robinson
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.