Granted Patent
Utility
US 6,048,656 · App. 09/310,060
Void-free underfill of surface mounted chips
Inventors:
Salman Akram, Tongbi Jiang
Patented Case
View Patent ↗
Granted: Apr 11, 2000
Filed: May 11, 1999
Inventors
Salman Akram
Tongbi Jiang
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.