Granted Patent
Utility
US 6,048,792 · App. 08/881,100
Method for manufacturing an interconnection structure in a semiconductor device
Inventors:
Kenji Watanabe, Masashi Ichikawa
Patented Case
View Patent ↗
Granted: Apr 11, 2000
Filed: Jun 24, 1997
Inventors
Kenji Watanabe
Masashi Ichikawa
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.