Granted Patent
Utility
US 6,049,038 · App. 09/124,910
Flip-chip resin sealing structure and resin sealing method
Inventor:
Motoji Suzuki
Patented Case
View Patent ↗
Granted: Apr 11, 2000
Filed: Jul 30, 1998
Inventor
Motoji Suzuki
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.