Granted Patent
Utility
US 6,054,744 · App. 09/098,810
Metal silicide film stress control by grain boundary stuffing
Inventors:
Yong-Jun Hu, Pai-Hung Pan
Patented Case
View Patent ↗
Granted: Apr 25, 2000
Filed: Jun 17, 1998
Inventors
Yong-Jun Hu
Pai-Hung Pan
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.