Granted Patent
Utility
US 6,057,178 · App. 09/160,889
Method of padding an electronic component, mounted on a flat substrate, with a liquid filler
Inventors:
Klaus-Peter Galuschki, Heinz Pilz
Patented Case
View Patent ↗
Granted: May 2, 2000
Filed: Sep 25, 1998
Inventors
Klaus-Peter Galuschki
Heinz Pilz
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.