Granted Patent
Utility
US 6,057,232 · App. 08/862,926
Wiring structure for semiconductor device and fabrication method therefor
Inventor:
Chang Jae Lee
Patented Case
View Patent ↗
Granted: May 2, 2000
Filed: May 27, 1997
Inventor
Chang Jae Lee
Assignee (at issue)
LG Semicon Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.