Granted Patent
Utility
US 6,058,013 · App. 09/109,671
Molded housing with integral heatsink
Inventors:
Gary Christopher, William R. Rochowicz
Patented Case
View Patent ↗
Granted: May 2, 2000
Filed: Jul 2, 1998
Inventors
Gary Christopher
William R. Rochowicz
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.