Granted Patent
Utility
US 6,058,020 · App. 09/221,787
Component housing for surface mounting of a semiconductor component
Inventors:
Jurgen Winterer, Gottfried Beer, Bernd Stadler
Patented Case
View Patent ↗
Granted: May 2, 2000
Filed: Dec 28, 1998
Inventors
Jurgen Winterer
Gottfried Beer
Bernd Stadler
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.