Granted Patent
Utility
US 6,059,894 · App. 09/057,430
High temperature flip chip joining flux that obviates the cleaning process
Inventor:
Rajendra D. Pendse
Patented Case
View Patent ↗
Granted: May 9, 2000
Filed: Apr 8, 1998
Inventor
Rajendra D. Pendse
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.