Granted Patent
Utility
US 6,059,983 · App. 08/936,066
Method for fabricating an overcoated printed circuit board with contaminant-free areas
Inventor:
Robert Noble
Patented Case
View Patent ↗
Granted: May 9, 2000
Filed: Sep 23, 1997
Inventor
Robert Noble
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.