Granted Patent
Utility
US 6,063,207 · App. 09/241,525
Surface treatment for bonding pad
Inventors:
Chia-Chieh Yu, Ta-Cheng Chou
Patented Case
View Patent ↗
Granted: May 16, 2000
Filed: Feb 1, 1999
Inventors
Chia-Chieh Yu
Ta-Cheng Chou
Assignee (at issue)
United Semiconductor Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.