Granted Patent
Utility
US 6,063,306 · App. 09/105,555
Chemical mechanical polishing slurry useful for copper/tantalum substrate
Inventors:
Vlasta Brusic Kaufman, Rodney Kistler, Shumin Wang
Patented Case
View Patent ↗
Granted: May 16, 2000
Filed: Jun 26, 1998
Inventors
Vlasta Brusic Kaufman
Rodney Kistler
Shumin Wang
Assignee (at issue)
Cabot Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.