Granted Patent
Utility
US 6,063,876 · App. 09/085,209
Epoxy resin composition and epoxy resin composition for encapsulating semiconductors
Inventors:
Atsuhito Hayakawa, Yasuyuki Murata, Norio Tohriiwa
Patented Case
View Patent ↗
Granted: May 16, 2000
Filed: May 27, 1998
Inventors
Atsuhito Hayakawa
Yasuyuki Murata
Norio Tohriiwa
Assignee (at issue)
SHELL OIL COMPANY
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.