IP Library Granted Patent US 6,066,556
Granted Patent Utility
US 6,066,556 · App. 09/184,918

Methods of fabricating conductive lines in integrated circuits using insulating sidewall spacers and conductive lines so fabricated

Inventor: Gi-Tae Jeong
Patented Case View Patent ↗
Granted: May 23, 2000 Filed: Nov 2, 1998
Inventor
Gi-Tae Jeong
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.

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Quick Facts
Patent No.
US 6,066,556
App. No.
09/184,918
Filed
1998-11-02
Granted
2000-05-23
Kind
A