Granted Patent
Utility
US 6,066,569 · App. 08/940,895
Dual damascene process for metal layers and organic intermetal layers
Inventor:
Dirk Tobben
Patented Case
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Granted: May 23, 2000
Filed: Sep 30, 1997
Inventor
Dirk Tobben
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.