Granted Patent
Utility
US 6,068,809 · App. 08/900,651
Method of injection molding elements such as semiconductor elements
Inventors:
Eugene Chen, Hohn Jong Hsiung, Kuang Hann Lin, Wing Lun Wong, Boon Meng Chan
Patented Case
View Patent ↗
Granted: May 30, 2000
Filed: Jul 25, 1997
Inventors
Eugene Chen
Hohn Jong Hsiung
Kuang Hann Lin
Wing Lun Wong
Boon Meng Chan
Assignee (at issue)
General Semiconductor, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.