IP Library › Granted Patent US 6,069,078
Granted Patent Utility
US 6,069,078 · App. 09/001,130

Multi-level interconnect metallization technique

Inventors: James C. Weaver, Rick C. Jerome
Patented Case View Patent ↗
Granted: May 30, 2000 Filed: Dec 30, 1997
Inventors
James C. Weaver
Rick C. Jerome
Assignee (at issue)
UTMC Microelectronic Systems Inc.

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Quick Facts
Patent No.
US 6,069,078
App. No.
09/001,130
Filed
1997-12-30
Granted
2000-05-30
Kind
A