Granted Patent
Utility
US 6,070,004 · App. 08/937,764
Method of maximizing chip yield for semiconductor wafers
Inventor:
Frank Prein
Patented Case
View Patent ↗
Granted: May 30, 2000
Filed: Sep 25, 1997
Inventor
Frank Prein
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.