Granted Patent
Utility
US 6,072,698 · App. 09/049,559
Chip module with heat insulation for incorporation into a chip card
Inventors:
Detelf Houdeau, Josef Kirschbauer, Hans-Georg Mensch, Peter Stampka, Hans-Hinnerk Steckhan
Patented Case
View Patent ↗
Granted: Jun 6, 2000
Filed: Mar 27, 1998
Inventors
Detelf Houdeau
Josef Kirschbauer
Hans-Georg Mensch
Peter Stampka
Hans-Hinnerk Steckhan
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.