Granted Patent
Utility
US 6,074,517 · App. 09/112,222
Method and apparatus for detecting an endpoint polishing layer by transmitting infrared light signals through a semiconductor wafer
Inventor:
Kunal N. Taravade
Patented Case
View Patent ↗
Granted: Jun 13, 2000
Filed: Jul 8, 1998
Inventor
Kunal N. Taravade
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.