Granted Patent
Utility
US 6,074,896 · App. 09/235,567
Method of processing semiconductor material wafers and method of forming flip chips and semiconductor chips
Inventor:
Ross S. Dando
Patented Case
View Patent ↗
Granted: Jun 13, 2000
Filed: Jan 22, 1999
Inventor
Ross S. Dando
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.