Granted Patent
Utility
US 6,074,897 · App. 09/238,706
Integrated circuit bonding method and apparatus
Inventors:
Yinon Degani, Lawrence Greenberg
Patented Case
View Patent ↗
Granted: Jun 13, 2000
Filed: Jan 28, 1999
Inventors
Yinon Degani
Lawrence Greenberg
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.