Granted Patent
Utility
US 6,074,947 · App. 09/113,274
Process for improving uniform thickness of semiconductor substrates using plasma assisted chemical etching
Inventor:
Peter B. Mumola
Patented Case
View Patent ↗
Granted: Jun 13, 2000
Filed: Jul 10, 1998
Inventor
Peter B. Mumola
Assignee (at issue)
PlasmaSil, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.