Granted Patent
Utility
US 6,077,720 · App. 09/213,124
Method for fabricating semiconductor laser facets using combined cleave and polish technique
Inventors:
Yoshifumi Yamaoka, Satoshi Watanabe, Norihide Yamada, Eric Marenger
Patented Case
View Patent ↗
Granted: Jun 20, 2000
Filed: Dec 15, 1998
Inventors
Yoshifumi Yamaoka
Satoshi Watanabe
Norihide Yamada
Eric Marenger
Assignee (at issue)
Agilent Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.