IP Library Granted Patent US 6,077,757
Granted Patent Utility
US 6,077,757 · App. 09/020,789

Method of forming chip semiconductor devices

Inventors: Hideki Mizuno, Kazunao Tokunaga
Patented Case View Patent ↗
Granted: Jun 20, 2000 Filed: Feb 9, 1998
Inventors
Hideki Mizuno
Kazunao Tokunaga
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 6,077,757
App. No.
09/020,789
Filed
1998-02-09
Granted
2000-06-20
Kind
A