Granted Patent
Utility
US 6,077,783 · App. 09/109,335
Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer
Inventors:
Derryl D. J. Allman, David W. Daniel, Michael F. Chisholm
Patented Case
View Patent ↗
Granted: Jun 20, 2000
Filed: Jun 30, 1998
Inventors
Derryl D. J. Allman
David W. Daniel
Michael F. Chisholm
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.