IP Library Granted Patent US 6,078,366
Granted Patent Utility
US 6,078,366 · App. 09/187,422

Array substrate comprising semiconductor contact layers having same outline as signal lines

Inventors: Masayuki Dohjo, Hideo Kawano, Akira Kubo, Makoto Shibusawa, Tetsuya Iizuka, Tamio Nakai, Kazushige Mori
Patented Case View Patent ↗
Granted: Jun 20, 2000 Filed: Nov 6, 1998
Inventors
Masayuki Dohjo
Hideo Kawano
Akira Kubo
Makoto Shibusawa
Tetsuya Iizuka
Tamio Nakai
Kazushige Mori
Assignee (at issue)
Kabushiki Kaisha Toshiba

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Quick Facts
Patent No.
US 6,078,366
App. No.
09/187,422
Filed
1998-11-06
Granted
2000-06-20
Kind
A