Granted Patent
Utility
US 6,080,596 · App. 08/920,273
Method for forming vertical interconnect process for silicon segments with dielectric isolation
Inventors:
Alfons Vindasius, Kenneth M. Sautter
Patented Case
View Patent ↗
Granted: Jun 27, 2000
Filed: Aug 22, 1997
Inventors
Alfons Vindasius
Kenneth M. Sautter
Assignee (at issue)
Cubic Memory, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.